CCD Image Sensors in Deep-Ultraviolet: Degradation Behavior by Flora Li, Arokia Nathan

By Flora Li, Arokia Nathan

I consult with this ebook very usually and locate the knowledge actual and good written. regrettably the Kindle model has been very poorly transcribed, the font seems to be terrible, there are lots of areas in the course of phrases, and plenty of unusual symbols (also frequently in the midst of words). This makes the publication very tricky to learn at the Kindle, notwithstanding in time it's attainable to to see what was once truly written.

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Extra info for CCD Image Sensors in Deep-Ultraviolet: Degradation Behavior and Damage Mechanisms (Microtechnology and MEMS)

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Typically, the thickness of a front-illuminated CCD is approximately 500 µm, compared to the thickness of a back-illuminated device which is whittled down to 45 µm or less [34]. The simplified structure of a backside-thinned back-illuminated photogate-based 36 3 CCD Imaging in the Ultraviolet (UV) Regime Incoming Photons Antireflective (AR) Coating p-Type Silicon n-Type Silicon Silicon Dioxide (SiO2) Insulating Layer Polysilicon Electrodes Fig. 7. The cross-section of a backside-thinned back-illuminated CCD sensor with photogates arranged in an area array format CCD is displayed in Fig.

After the measurement of each charge packet, the n+ diffusion region is reset by draining away any residual charges; this ensures that the residual charges do not disturb the measurement of the next charge packet. The reset operation is accomplished by connecting the n+ floating diffusion node to a positive supply voltage via a reset transistor; here, the reset transistor acts as a switch and is controlled by a reset clock pulse. The voltage on the floating diffusion output is sensed by a source-follower amplifier stage, which is then fed to the outside world.

Since an increasing number of industrial applications are shifting to intense DUV sources, this trend necessitates the development of high performance DUV sensors for process control and monitoring purposes. Examples of DUV imaging applications include semiconductor lithography systems, micromachining, wafer inspection, UV spectroscopy, microscopy, water treatment, and flame monitoring. Electronic imaging with CCD cameras are preferable in these applications, because the CCD technology is mature and it offers a digital imaging solution with high speed, high resolution and low noise capabilities.

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